Hybrid Micro Circuit Manufacturing
VCB Electronics has complete infrastructure for Hybrid Micro Circuit Manufacturing. VCB can do Thick Film Printing, Firing, Trimming, Scribing Process to manufacture ceramic substrates, on which the SMD components are assembled and soldered using reflow process. Then chips and dies are assembled using epoxy and wire bonding enables the connection from pads on the chip to the pads on the substrate. After Testing, substrates get assembled into a metal package, followed by sealing of the packages and complete validation and screening process as needed prior to delivery to customers.
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VCB Electronics Private Limited is a company incubated in 2001 with the aim to provide a dedicated facility for fabrication, testing and evaluation of avionics packages. Now VCB has world class manufacturing facility for thick film hybrid microcircuits and electronics module assembly
VCB is located at Pune and the core management team comprises highly qualified, experienced professionals, technocrats and experts in design, fabrication, automated electrical testing, environmental testing and quality assurance functions for the products like hybrid microcircuits, chip and wire bonding, electronics module assembly using SMD and leaded soldering techniques essential for space & avionics applications.
Main focus of VCB Electronics is to fulfil the requirements of Indian Space Research Organizations (ISRO), Défense Research and Development Organization (DRDO) and Défense Public Sector Units (DPSU).
VCB Electronics strength is in design, manufacturing and reliability testing of the DC-DC converters for space and military application
VCB is an ISO 9001:2015 certified private limited company in the field of HI‐RELIABILITY Electronics with main focus to fulfil the requirements of Indian ecosystem.
Please contact us for more Information:
https://vcbelec.com/
+91 20 66702000
+91 20 66702044
vcbmarketing@vcbelec.com
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